Headlines · Summit PostTucsen Photonics Co.,Ltd is presenting its industrial imaging solutions for next-generation semiconductor inspection at SEDEX 2026, taking place from October 14 to 16 at COEX in Seoul, South Korea. The company's showcase addresses three key inspection areas: high-speed front-end wafer and mask inspection, advanced packaging and automated optical inspection (AOI), and vacuum-based metrology utilizing soft X-ray and extreme ultraviolet (EUV) light.
Semiconductor equipment manufacturers face increasing demands for faster throughput, wider fields of view, and image stability across extended production runs. Tucsen responds to these challenges with a portfolio of camera architectures tailored to specific stages of the inspection workflow, rather than a one-size-fits-all solution.
Tucsen’s semiconductor inspection solutions are organized around two main architectures: line scan and area scan cameras. For high-speed front-end wafer and mask inspection, the Gemini TDI series employs multi-stage signal accumulation to enhance sensitivity and signal-to-noise ratio during continuous motion. The Gemini 8KTDI model supports line rates up to 1 MHz at 8K resolution and transfers data via a 100G CoF interface, aiming to capture low-contrast defects clearly without reducing scan speed.
When higher resolution and broader coverage are required, the Libra series of large-format industrial cameras is utilized. The recently introduced Libra 27105 features a 105 MP Sony sensor with a 39.7 mm (2.5″) optical format and operates at 112 fps at full resolution. This capability allows more area to be imaged per frame, reducing the need for stitching in high-speed AOI, defect review, and workflows that use AI-based defect classification.
By offering both line scan and area scan architectures, Tucsen enables equipment manufacturers and system integrators to select the optimal solution for each inspection stage. This approach avoids the compromises that can result from treating diverse inspection requirements as a single problem.
Certain inspection and metrology processes extend beyond the capabilities of standard visible-light cameras. To address these needs, Tucsen has developed the Dhyana XF and XV series—vacuum-compatible sCMOS cameras designed for direct detection of soft X-ray and EUV photons in high-vacuum environments. These series utilize back-illuminated sensors with high quantum efficiency and are engineered to operate in vacuum conditions down to 10⁻⁷ Pa. They are widely used in technical fields such as EUV inspection, expanding Tucsen’s semiconductor product portfolio from conventional optical inspection to specialized metrology outside the visible spectrum.
All products are supported by Tucsen’s internal engineering and manufacturing teams, which cover optics, electronics, mechanics, computing, and software. The company develops FPGA-based architectures, in-house SDKs, standardized interfaces, and production-level integration. Manufacturing is conducted across more than 10,000 square meters, including Class 100 and Class 1,000 cleanrooms and flexible production lines. Standardized processes in production, testing, and quality control ensure consistent camera performance over time, a critical factor for semiconductor fabrication facilities.
Tucsen also offers customized imaging solutions for inspection requirements not addressed by standard products, aiming to streamline the transition from evaluation to deployment.
The company’s strategy in industrial semiconductor imaging focuses on building a robust technology platform. In high-sensitivity imaging, this involves ongoing work on low-noise design, quantum efficiency, thermal stability, and broad spectral response. For high-throughput imaging, Tucsen develops large-format and high-speed camera platforms to enhance inspection efficiency while maintaining image quality during continuous operation. The portfolio covers front-end wafer scanning, advanced packaging, and specialized metrology, supported by expertise in vacuum compatibility, deep cooling, ultra-low dark current control, and extended spectral response.
Engineering teams evaluating imaging solutions for wafer inspection, advanced packaging, or specialized metrology can engage with Tucsen’s engineering group to discuss specific application requirements. Product documentation and sample evaluation support are available upon request. For additional details, visit Tucsen’s semiconductor solutions page or contact the engineering team.
About Tucsen Photonics
Tucsen Photonics specializes in the research and development of scientific cameras for photon detection, providing imaging products and solutions for research microscopy, industrial inspection, and frontier exploration. The company advances imaging performance and application capabilities, supporting the adoption of photonic information technologies across scientific research and industrial applications.
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Media Contact:
Molly He
Tucsen Photonics Co.,Ltd
mollyhe@tucsen.com
